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BS EN IEC 60115-2:2026+A11:2026 Fixed resistors for use in electronic equipment - Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), 2026
- undefined [Go to Page]
- European foreword
- Endorsement notice
- English [Go to Page]
- CONTENTS
- FOREWORD
- 1 Scope
- 2 Normative references
- 3 Terms and definitions [Go to Page]
- 3.1 Terms
- Figures [Go to Page]
- Figure 1 – Illustration of a typical axial leaded resistor
- Figure 2 – Illustrations of typical radial leaded resistors
- 3.2 Product technologies
- 3.3 Product classification
- 4 Preferred characteristics [Go to Page]
- 4.1 General
- 4.2 Style and dimensions [Go to Page]
- 4.2.1 Preferred styles and outline dimensions
- Figure 3 – Shape and dimension of axial leaded resistors
- Tables [Go to Page]
- Table 1 – Preferred styles of axial leaded resistors [Go to Page]
- 4.2.2 Length of excessive coating or welding bead
- 4.2.3 Lead wire spacing
- Figure 4 – Alternative methods for specification of the length of excessive protective coating on axial leaded resistors [Go to Page]
- 4.2.4 Lead eccentricity
- Figure 5 – Lead-wire spacing of axial leaded resistors with bent leads
- 4.3 Preferred climatic categories
- Figure 6 – Specification of the lead eccentricity of axial leaded resistors
- 4.4 Resistance
- 4.5 Tolerances on resistance
- 4.6 Rated dissipation P70
- 4.7 Limiting element voltage Umax
- Figure 7 – Derating curve
- 4.8 Insulation voltage Uins
- 4.9 Insulation resistance Rins
- 5 Tests and test severities [Go to Page]
- 5.1 General provisions for tests applied by this specification
- 5.2 Preparation of specimens [Go to Page]
- 5.2.1 Drying
- 5.2.2 Mounting of components on test boards
- Figure 8 – Basic layout for mechanical, environmental and electrical tests
- Figure 9 – Assembly of specimens to the test board
- Table 2 – Test board dimensions [Go to Page]
- 5.2.3 Mounting of components on a test rack
- Figure 10 – Mounting of axial leaded specimens on a rack, top view
- 5.3 Details of applied tests [Go to Page]
- 5.3.1 Resistance
- 5.3.2 Temperature coefficient of resistance
- 5.3.3 Temperature rise
- Figure 11 – Examples of specimen lead fixation devices [Go to Page]
- 5.3.4 Endurance at the rated temperature 70 °C
- 5.3.5 Endurance at a maximum temperature: UCT
- 5.3.6 Short-term overload
- 5.3.7 Single-pulse high-voltage overload test
- 5.3.8 Periodic-pulse high-voltage overload test
- 5.3.9 Electrostatic discharge (ESD) test
- 5.3.10 Visual examination
- Table 3 – Preferred aggravated overload conditions [Go to Page]
- 5.3.11 Gauging of dimensions
- 5.3.12 Detail dimensions
- 5.3.13 Robustness of terminations
- 5.3.14 Vibration
- 5.3.15 Rapid change of temperature
- 5.3.16 Rapid change of temperature, ≥ 100 cycles
- 5.3.17 Climatic sequence
- 5.3.18 Damp heat, steady state
- 5.3.19 Solderability, with lead-free solder
- 5.3.20 Solderability, with SnPb solder
- 5.3.21 Resistance to soldering heat
- 5.3.22 Solvent resistance
- 5.3.23 Insulation resistance
- 5.3.24 Voltage proof
- 5.3.25 Flammability
- 5.4 Optional and/or additional tests [Go to Page]
- 5.4.1 Endurance at room temperature
- 5.4.2 Single-pulse high-voltage overload test
- 5.4.3 Periodic-pulse overload test
- 5.4.4 Operation at low temperature
- 5.4.5 Damp heat, steady state, accelerated
- 6 Performance requirements [Go to Page]
- 6.1 General
- 6.2 Limits for change of resistance at tests
- Table 4 – Limits for the change of resistance at tests
- 6.3 Temperature coefficient of resistance
- 6.4 Temperature rise
- Table 5 – Permitted change of resistance due to the variation of temperature
- 6.5 Visual examination [Go to Page]
- 6.5.1 General visual criteria
- 6.5.2 Visual criteria after tests
- 6.5.3 Visual criteria for the packaging
- 6.6 Solderability
- 6.7 Insulation resistance
- 6.8 Flammability
- 7 Marking, packaging and ordering information [Go to Page]
- 7.1 Marking of the component
- 7.2 Packaging
- 7.3 Marking of the packaging
- 7.4 Ordering information
- 8 Detail specifications [Go to Page]
- 8.1 General
- 8.2 Information to be specified in a detail specification [Go to Page]
- 8.2.1 Outline drawing or illustration
- 8.2.2 Style and dimensions
- 8.2.3 Climatic category
- 8.2.4 Resistance range
- 8.2.5 Tolerances on resistance
- 8.2.6 Rated dissipation P70
- 8.2.7 Limiting element voltage Umax
- 8.2.8 Insulation voltage Uins
- 8.2.9 Insulation resistance Rins
- 8.2.10 Test severities
- 8.2.11 Limits of resistance change after testing
- 8.2.12 Temperature coefficient of resistance
- 8.2.13 Marking
- 8.2.14 Ordering information
- 8.2.15 Mounting
- 8.2.16 Storage
- 8.2.17 Transportation
- 8.2.18 Additional information
- 8.2.19 Quality assessment procedures
- 8.2.20 0 Ω resistors
- 9 Quality assessment procedures [Go to Page]
- 9.1 General
- 9.2 Definitions [Go to Page]
- 9.2.1 Primary stage of manufacture
- 9.2.2 Structurally similar components
- 9.2.3 Assessment level EZ
- 9.3 Formation of inspection lots
- 9.4 Approved component (IECQ AC) procedures
- 9.5 Qualification approval (QA) procedures [Go to Page]
- 9.5.1 General
- 9.5.2 Qualification approval
- 9.5.3 Quality conformance inspection
- 9.6 Capability certification (IECQ AC-C) procedures
- 9.7 Technology certification (IECQ-AC-TC) procedures
- 9.8 Periodical evaluation of termination plating
- 9.9 Delayed delivery
- 9.10 Certified test records
- 9.11 Certificate of conformity (CoC)
- Table 6 – Test schedule for the qualification approval
- Table 7 – Test schedule for the quality conformance inspections
- Annex A (normative) Symbols and abbreviated terms [Go to Page]
- A.1 Symbols
- A.2 Abbreviated terms
- Annex B (normative) Visual examination acceptance criteria [Go to Page]
- B.1 General
- B.2 Criteria for general visual inspection of specimens
- B.3 Criteria for visual inspection of specimens after tests
- Annex C (normative) Workmanship requirements for the assembly of leaded film resistors [Go to Page]
- C.1 General
- C.2 Lead forming [Go to Page]
- C.2.1 General
- Figure C.1 – Lead forming dimensions [Go to Page]
- C.2.2 Means for support of mounting height
- Table C.1 – Lead bend radius
- C.3 Mounting [Go to Page]
- C.3.1 General
- Figure C.2 – Examples of mounting height support
- Table C.2 – Recommended circuit board bore diameters [Go to Page]
- C.3.2 Lateral mounting
- Figure C.3 – Clearance between coating and solder
- Figure C.4 – Lateral mounting [Go to Page]
- C.3.3 Upright mounting
- Figure C.5 – Upright mounting
- Table C.3 – Clearance of lateral mounted resistors
- C.4 Lead trimming
- Figure C.6 – Lead protrusion
- Figure C.7 – Lead end distortion
- Annex D (normative) Zero-ohm resistors (jumpers) [Go to Page]
- D.1 General
- D.2 Preferred characteristics
- D.3 Tests and test severities
- D.4 Performance requirements
- D.5 Marking, packaging and ordering information
- D.6 Detail specification
- D.7 Quality assessment procedures
- Annex E (informative) Guidance on the application of optional and additional tests [Go to Page]
- E.1 General
- E.2 Endurance at room temperature
- Table E.1 – Implementation of the test endurance at room temperature
- E.3 Single-pulse high-voltage overload test
- Table E.2 – Implementation of the single-pulse high-voltage overload test
- E.4 Periodic- pulse overload test
- E.5 Operation at low temperature
- Table E.3 – Implementation of the periodic-pulse overload test
- E.6 Damp heat, steady state, accelerated
- Table E.4 – Implementation of the operation at low temperature test
- Table E.5 – Implementation of the test damp heat, steady state, accelerated
- Annex F (informative) Radial formed types [Go to Page]
- F.1 General [Go to Page]
- F.1.1 Applicability of this annex
- F.1.2 Denomination of radial formed types
- Figure F.1 – Production flow and different scopes of quality assurance [Go to Page]
- F.1.3 Coated lead wires
- F.1.4 Means for support of mounting height
- F.1.5 Means for retention
- F.2 Radial formed types for through-hole assembly [Go to Page]
- F.2.1 Radial formed type with lateral body position
- Figure F.2 – Shape and dimensions of radial formed resistor for lateral body position
- Figure F.3 – Shape and dimensions of radial formed resistor for lateral body position with kinked lead wires [Go to Page]
- F.2.2 Radial formed type with upright body position
- Figure F.4 – Shape and dimensions of radial formed resistor for upright body position
- Table F.1 – Feasible lead-wire spacing of radial formed resistor for lateral body position
- Figure F.5 – Shape and dimensions of radial formed resistor for upright body position and wide spacing
- Figure F.6 – Shape and dimensions of radial formed resistor for upright body position and wide spacing, with kinked lead wire
- F.3 Radial formed types for surface-mount assembly
- Figure F.7 – Shape and dimensions of radial formed resistor for surface-mount assembly (Z-bend)
- Table F.2 – Feasible lead-wire spacing of radial formed resistor for upright body position
- F.4 Packaging [Go to Page]
- F.4.1 Packaging of resistors formed for through-hole assembly
- Figure F.8 – Land pattern dimensions for surface-mount assembly [Go to Page]
- F.4.2 Packaging of resistors formed for surface-mount assembly
- F.5 Quality assessment [Go to Page]
- F.5.1 General
- F.5.2 Quality assessment of formed resistors
- F.5.3 Forming of finished resistors of assessed quality
- F.5.4 Special inspection requirements
- Annex X (informative) Cross-references for the prior edition of this specification [Go to Page]
- Table X.1 – Cross-references to clauses of previous edition
- Bibliography [Go to Page]
