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IEC 62148-21 Ed. 2.0 b:2021 Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid, 2021
- English [Go to Page]
- CONTENTS
- FOREWORD
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- 4 Terminal position numbering
- 5 Code of package nominal dimensions
- 6 Symbols and drawings
- 7 Dimensions and tolerances
- Bibliography
- Figure 1 – S-FBGA and S-FLGA outline
- Figure 2 – Mechanical gauge drawing
- Figure 3 – Array of terminal-existence areas
- Table 1 – Dimensions and tolerances
- Table 2 – Combination list of D, E, MD, and ME for e = 0,30 mm pitch S-FBGA (informative)
- Table 3 – Combination list of D, E, MD, and ME for e = 0,25 mm pitch S-FLGA
- Français [Go to Page]
- SOMMAIRE
- AVANT-PROPOS
- 1 Domaine d’application
- 2 Références normatives
- 3 Termes et définitions
- 4 Numérotation des positions de bornes
- 5 Code des dimensions nominales de boîtier
- 6 Symboles et dessins
- 7 Dimensions et tolérances
- Bibliographie
- Figure 1 – Encombrement du S-FBGA et du S-FLGA
- Figure 2 – Dessin de gabarit mécanique
- Figure 3 – Matrice de zones d’existence de bornes
- Tableau 1 – Dimensions et tolérances
- Tableau 2 – Liste de combinaisons de D, E, MD et ME pour e = pas de 0,30 mm, S-FBGA(à titre informatif)
- Tableau 3 – Liste de combinaisons de D, E, MD, et ME pour e = pas de 0,25 mm, S-FLGA [Go to Page]