ASTM F144-80(2000)
Historical Standard: ASTM F144-80(2000) Standard Practice for Making Reference Glass-Metal Sandwich Seal and Testing for Expansion Characteristics by Polarimetric Methods
SUPERSEDED (see Active link, below)
ASTM F144
1. Scope
1.1 This practice covers the preparation and testing of a reference glass-metal sandwich seal for determining stress in the glass or for determining the degree of thermal expansion (or contraction) mismatch between the glass and metal. Tests are in accordance with Method F218 (Section 2).
1.2 This practice applies to all glass and metal (or alloy) combinations normally sealed together in the production of electronic components.
1.3 The practical limit of the test in deriving mismatch is approximately 300 ppm, above which the glass is likely to fracture.
1.4 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
ASTM Standards
F15 Specification for Iron-Nickel-Cobalt Sealing Alloy
F30 Specification for Iron-Nickel Sealing Alloys
F31 Specification for 42 % Nickel-6 % Chromium-Iron Sealing Alloy
F47 Test Method for Crystallographic Perfection of Silicon by Preferential Etch Techniques
F79 Specification for Type 101 Sealing Glass
F105 Specification for Type 58 Borosilicate Sealing Glass
F218 Test Method for Measuring Optical Retardation and Analyzing Stress in Glass
F256 Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium
Keywords
expansion mismatch; glass-metal seals; Glass; Glass electronic seals; Electronic materials/applications; Metal electronic components/devices; Sandwich seals (for electronic devices); Seals--electronic applications; Specimen preparation (for testing)--semiconductor materials; Thermal expansion/contraction;
ICS Code
ICS Number Code 21.140 (Seals, glands)
DOI: 10.1520/F0144-80R00
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