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  • IEC
    IEC 61189-5-601 Ed. 1.0 b:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
    Edition: 2021
    $730.13
    / user per year

Content Description

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts).
The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.



About IEC

The IEC is a global, not-for-profit membership organization, whose work underpins quality infrastructure and international trade in electrical and electronic goods. The IEC facilitates technical innovation, affordable infrastructure development, efficient and sustainable energy access, smart urbanization and transportation systems, climate change mitigation, and increases the safety of people and the environment.

 

The IEC brings together ~170 countries and provides a global, neutral and independent standardization and conformity assessment platform for 30 000 experts globally. It administers 4 Conformity assessment systems whose members certify that devices, systems, installations, services and people work as required.

 

The IEC publishes around 10 000 IEC International Standards which together with conformity assessment provide the technical framework that allows governments to build national quality infrastructure and companies of all sizes to buy and sell consistently safe and reliable products in most countries of the world. IEC International Standards serve as the basis for risk and quality management and are used in testing and certification to verify that manufacturer promises are kept.
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